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LSI SOCKET WITH/WITHOUT ACTIVE THERMAL

HiCon has developed and provided advanced solutions to Burn-in test for fine pitch and large I/O IC. Hr-Contact for fine pitch IC and optimized socket design for customer’s special needs provide reliable and low cost solutions to Burn-in test for IC with fine pitch and large I/O. HiCon also provides customized thermal solutions along with burn-in solutions.

-Application: 1,200BGA, 42.5x42.5
-Ball Pitch: 1.0mm
-Pin type: Hi-Contact
-Pin Length:4.6mm
-Contact force:19gf@0.45mm
-With Heat sink , Heater & RTD    sensor

-Application: 2,400BGA, 50X50
-Ball Pitch: 1.0mm
-Pin type: Hi-Contact
-Pin Length:4.6mm
-Contact force:17gf@0.45mm
-With Heat sink , Heater & RTD  sensor

-Application:1,600BGA, 37.5x37  
-Ball Pitch: 0.70/0.74mm
-Pin type: Hr-Contact
-Pin Length:4.6mm
-Contact force:15gf@0.40mm
-With Heat sink , Heater & RTD  sensor

-Application:1,300BGA 
-Ball Pitch: 0.35mm
-Pin type: Hr-Contact
-Pin Length:3.3mm
-Contact force:12.7gf@0.40mm
-With or W/O Heat sink , Heater &  RTD sensor.

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  Tel : +1 480-912-4038       Fax : +1 480-892-3301       Email : info@hicon-global.com
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